CircuitSAF™ ME-456 is a one component, high purity, fast cure, semiconductor grade epoxy encapsulant dam material developed for use in the encapsulation of wire bonded and flip devices where a dam in needed to restrict the flow of a cavity fill encapsulant. It has a high viscosity with a high thixotropic index that can be dispensed around the perimeter of the area to be encapsulated. Once CircuitSAF™ ME-456 has been dispensed, the area inside the dam can be encapsulated with Lord's Cavity Fill Encapsulant, CircuitSAF™ ME-455, and both materials can be cured at the same time.All information provided by Lord. |