Available Properties |
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- Volatiles
- Water Absorption, ASTM E595
- Outgassing - Total Mass Loss, ASTM E595
- Collected Volatile Condensable Material, ASTM E595
- Tensile Strength, Flatwise, Note 1, Core failure
- Tensile Strength, Flatwise, Note 5, Core failure
- Tensile Strength, Flatwise, Note 2, Core failure
- Tensile Strength, Flatwise, Note 3, Cohesive failure
- Tensile Strength, Flatwise, Note 4, Cohesive failure
- Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch, Conditioning: 500 hours at 350°F (177°C)
- Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch, Conditioning: 3000 hours at 350°F (177°C)
- Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch, Conditioning: 3000 hours at 350°F (177°C)
- Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch, Conditioning: 500 hours at 350°F (177°C)
- Tensile Strength, Flatwise, Metal skins-to-honeycomb core
- Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch, Conditioning: 1000 hours at 350°F (177°C)
- Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch, Conditioning: 3000 hours at 350°F (177°C)
- Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch, Conditioning: 1000 hours at 350°F (177°C)
- Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch, Conditioning: 1000 hours at 350°F (177°C)
- Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch, Conditioning: 500 hours at 350°F (177°C)
- Tensile Strength, Flatwise, Metal skins-to-honeycomb core
- Tensile Strength, Flatwise, Metal skins-to-honeycomb core
- Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch
- Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch
- Tensile Strength, Flatwise, Metal skins-to-honeycomb core
- Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch
- Tensile Strength, Flatwise, Metal skins-to-honeycomb core
- Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 3000 hours at 350°F (177°C)
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 3000 hours at 350°F (177°C)
- Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch
- Adhesive Bond Strength, Lap, CYCOM® 5208/3K70PW
- Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 3000 hours at 350°F (177°C)
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch
- Adhesive Bond Strength, Lap, wet, CYCOM® 5250-3/3781
- Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch
- Adhesive Bond Strength, Lap, CYCOM® 5208/3K70PW
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 72 hour water boil
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 30 days at 95% RH, 160°F (71°C)
- Adhesive Bond Strength, Lap, wet, CYCOM® 5250-3/3781
- Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch
- Adhesive Bond Strength, Lap, wet, CYCOM® 5250-3/3781
- Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch Phosphoric acid anodize
- Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch
- Adhesive Bond Strength, Lap, CYCOM® 5575-2/7781
- Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch Phosphoric acid anodize
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch
- Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch Phosphoric acid anodize
- Adhesive Bond Strength, Lap, CYCOM® 5250-3/3781
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 1000 hours at 350°F (177°C)
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 30 days at 95% RH, 160°F (71°C)
- Adhesive Bond Strength, Lap, CYCOM® 5250-3/3781
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 1000 hours at 350°F (177°C)
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 30 days 5% salt spray at 95°F (35°C)
- Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch Phosphoric acid anodize
- Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch Phosphoric acid anodize
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 30 days 5% salt spray at 95°F (35°C)
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 1000 hours at 350°F (177°C)
- Adhesive Bond Strength, Lap, CYCOM® 5575-2/7781
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 7 days hydraulic oil
- Adhesive Bond Strength, Lap, CYCOM® 5250-3/3781
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 72 hour water boil
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 30 days 5% salt spray at 95°F (35°C)
- Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch Phosphoric acid anodize
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 7 days JP4
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 500 hours at 350°F (177°C)
- Adhesive Bond Strength, Lap, CYCOM® 5250-3/3781
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 500 hours at 350°F (177°C)
- Adhesive Bond Strength, Lap, CYCOM® 5208/3K70PW
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 72 hour water boil
- Adhesive Bond Strength, Lap, CYCOM® 5575-2/7781
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 7 days hydraulic oil
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 7 days JP4
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 7 days hydraulic oil
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 7 days JP4
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 30 days at 95% RH, 160°F (71°C)
- Adhesive Bond Strength, Lap, CYCOM® 5575-2/7781
- Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 500 hours at 350°F (177°C)
- Dielectric Constant
- Dielectric Constant
- Dielectric Loss Index
- Dielectric Loss Index
- CTE, linear, without post-cure
- CTE, linear, with post-cure
- Maximum Service Temperature, Air
- Minimum Service Temperature, Air
- Glass Transition Temp, Tg, dry
- Processing Temperature, Recommended Cure
- Processing Temperature, Recommended Post-Cure
- Gel Time
- Gel Time
- Gel Time
- Shelf Life
- Shelf Life
- Shelf Life
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