Product Description: EPO-TEK\® T7110 is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer, medical or optics. Advantages & Application Notes: - Low viscosity allows for bubble-free potting and encapsulation.
- Room temperature or low temperature cure (< 100°C) permits use in temperature sensitive devices.
- Suggested Applications:
- Semiconductor: capillary flow underfill for flip chip mounted die; possible glob top “fill” encapsulant.
- Electronics: heat sinking; thermally conductive potting and general protection of PCB and SMDs; potting thermistors into cavities; potting and protection of resistor coils or Peltier devices.
- Hybrids: potting power modules found in electronics such as cockpit, aerospace and Rf/Microwave devices.
- Optical: encapsulation around copper coils found in nuclear, x-ray, and magnetic imaging; heat sinking outdoor LCD / touch panels exposed to sunlight.
- Low exothermic chemistry during polymerization. This allows up to one liter to be cast or potted in volumes.
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