Advantages & Application Notes:

• A moderate viscosity resin with flowing properties enables potting of cavities, packages and housings.
• Contains a coarse grade of filler, which needs to be taken into account in all bonding, sealing and potting applications.
• Pure white color after cure allows for easy inspection by operators on common electronic packaging surfaces.
• Versatility in cure: 23ºC and 100ºC ambient, box oven or tunnel oven processes.
• Suggested Applications:
  • Hybrids: thermally conductive adhesive bonding ceramics and metals
  • Electronics:
    • General PCB level potting and adhesive applications. Bonding metal and composite heat sinks to PCBs or SMDs.
    • Transformers: potting of Cu coils, magnets, inductors and other SMDs into their respective casing.
  • Medical Devices
    • Heat sinking of x-ray and ultrasound circuits via adhesive and potting processes.

Information Provided by Epoxy Technology