Resinlab® EP965 Clear Unfilled Electronic Grade Epoxy Encapsulant

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Resinlab® EP965 Clear Unfilled Electronic Grade Epoxy Encapsulant
Categories:	Polymer; Thermoset; Epoxy; Epoxy Cure Resin; Epoxy Encapsulant, Unreinforced
Material Notes:	Resinlab™ EP965 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release and a smooth high gloss surface. It has very good resistance to water, acids and bases and most organic solvents. It was especially formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP965 Clear will reach full cure at room temperature within 24 hours. Cure time can be accelerated by the application of heat after product has gelled. Times and temperatures from 1 hour at 65°C to 20 minutes at 110°C are typical for small castings (less than 50 grams). Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
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Physical Properties	Original Value	Comments

Specific Gravity	0.970 g/cc	Part B; TM R050-16
	1.07 g/cc	Mixed; TM R050-16
	1.16 g/cc	Part A; TM R050-16
Water Absorption	0.18 % @Time 86400 sec	TM R050-35
Viscosity	6000 cP	Part B, RVT, #6, 20 rpm; TM R050-12
	11000 cP	Mixed; TM R050-12
	16000 cP	Part A, RVT, #6, 20 rpm; TM R050-12

Mechanical Properties	Original Value	Comments
Hardness, Shore D	80	TM R050-17
Tensile Strength at Break	8500 psi	TM R050-36
Tensile Strength, Ultimate	8500 psi	TM R050-36
Tensile Strength, Yield	3000 psi	TM R050-36
Elongation at Break	0.00 - 2.0 %	TM R050-36
Tensile Modulus	400 ksi	TM R050-36
Compressive Yield Strength	10000 psi	TM R050-38
Compressive Strength	22000 psi	Ultimate; TM R050-38
	22000 psi	Break; TM R050-38
Compressive Modulus	300 ksi	TM R050-38
Adhesive Bond Strength	1500 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37

Electrical Properties	Original Value	Comments
Volume Resistivity	8.00e+14 ohm-cm
Dielectric Constant	4.2 @Frequency 100 Hz, Temperature 25.0 °C
Dielectric Strength	410 V/mil

Thermal Properties	Original Value	Comments
CTE, linear	80.0 µm/m-°C @Temperature <=61.0 °C	below Tg
	180 µm/m-°C @Temperature >=61.0 °C	above Tg
Thermal Conductivity	0.178 W/m-K
Maximum Service Temperature, Air	150 °C
Minimum Service Temperature, Air	-40.0 °C
Glass Transition Temp, Tg	61.0 °C	TM R050-25

Optical Properties	Original Value	Comments
Transmission, Visible	90 %	clear; thickness not quantified

Processing Properties	Original Value	Comments
Pot Life	15 - 20 min	Mass: 50g; TM R050-19

Descriptive Properties
Color	Clear
Mix Ratio	1:1	Volume
	100:85	Weight

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