Redux 308 is a high-strength film adhesive curing at 350°F. It is suitable for a wide range of structural bonding applications including metal to metal bonding and sandwich constructions, where operating temperatures of up to 250°F may be experienced.Features: Cures at 350°F; Good structural performance and service temperature up to 250°F; Excellent environmental resistance; Superior aging performance for continuous operation up to 250°F; Low volatile content (solventless process). Applications: Metal to metal bonding; Structural sandwich constructions |