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Hexcel® Redux® 308 Modified epoxy film adhesive
Categories: Polymer; Adhesive; Film; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Redux 308 is a high-strength film adhesive curing at 350°F. It is suitable for a wide range of structural bonding applications including metal to metal bonding and sandwich constructions, where operating temperatures of up to 250°F may be experienced.

Features: Cures at 350°F; Good structural performance and service temperature up to 250°F; Excellent environmental resistance; Superior aging performance for continuous operation up to 250°F; Low volatile content (solventless process).
Applications: Metal to metal bonding; Structural sandwich constructions

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Mechanical PropertiesOriginal ValueComments
Tensile Strength, Yield 1.16 ksi
@Temperature 21.1 °C
Flatwise Tensile
Shear Strength 2.90 ksi
@Temperature 121 °C
Lap Shear
 6.30 ksi
@Temperature 71.1 °C
Lap Shear
 6.80 ksi
@Temperature 21.1 °C
Lap Shear
Peel Strength 27.0 pli
@Temperature 21.1 °C
Bell Peel
 
Processing PropertiesOriginal ValueComments
Shelf Life 12.0 Month
@Temperature -17.8 °C
 
Descriptive Properties
Areal Weight (psf)0.06
Roll Width (in)39
Standard Roll (ft2)540

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PHEXC432 / 99251

Specialty Compounds RTP Company

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