| Product Description: EPO-TEK® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Advantages & Application Notes: - Low Tg, several weeks of pot-life and low modulus are a few of its traits.
- It is particularly suitable for bonding ferrite cores in power device plastic packaging.
- Excellent adhesion to PCBs, ceramics, most metals and lead frames.
- Suggested Applications:
- Semiconductor:
- IC packaging on lead frame or FR4 PCB, accepting Epoxy Molding Compound plastic SMD encapsulation.
- Low stress on large die attach > 500 mil x 500 mil.
- Electronics:
- Bonding Cu and Al heat sinks.
- Staking SMDs to PCBs and other substrates.
- Optics:
- LED die attach.
- White color after cure is attractive for LED, x-ray scintillator, and opto-coupler circuits.
- Heat sinking laser diode packages.
- Fiber optic component packaging and assembly.
- Its smooth and creamy viscosity enables high speed dispensing processes; however, its thixotropic nature allows for screen printing techniques as well.
Information Provided by Epoxy Technology |
