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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

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Master Bond EP21LVMED Two Component, Low Viscosity USP Class VI Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: Key Features:
  • USP Class VI certified
  • Outstanding thermal cycling resistance
  • Cures at room temperature or elevated temperatures
  • Excellent chemical resistance
  • Serviceable from -65°F to +250°F
Product Description: Master Bond EP21LVMed is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. To optimize the system’s properties and to ensure biocompatibility, a highly recommended cure schedule is overnight at room temperature followed by 2-3 hours at 150-200°F. It has a convenient one to one mix ratio by weight. EP21LVMed produces high strength, durable bonds which hold up well to thermal cycling and resist many chemicals including water, acids, bases and most importantly, EtO, radiation and many cold sterilants. It is serviceable over the wide temperature range of -65°F to +250°F. It bonds well to a variety of substrates including metals, glass, ceramics, wood, rubbers and many plastics. Once cured, EP21LVMed is an outstanding electrical insulator. This, combined with its low viscosity, makes this system an excellent encapsulating and potting epoxy. It fully passes USP Class VI testing for biocompatibility and it is widely used for medical applications. EP21LVMed contains no solvents or diluents. The color of Part A is clear, while the color of Part B is amber.

Product Advantages:

  • Convenient mixing: one to one mix ratio by weight
  • Easy application: only contact pressure required while curing; adhesive spreads readily
  • High bonding strength to a wide variety of substrates
  • Superior physical strength properties
  • Good electrical insulation properties; ideal for potting and encapsulation
  • Resists EtO and radiation as well as many chemical sterilants

Information provided by Master Bond Inc.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesOriginal ValueComments
Viscosity 10000 - 14000 cPPart A
 11000 - 15000 cPPart B
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D >= 70
Tensile Strength >= 7500 psi
Tensile Modulus 300000 - 350000 psi
Adhesive Bond Strength >= 2800 psiTensile lap, Aluminum to Aluminum
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+15 ohm-cm
Dielectric Constant 2.79
@Frequency 60 Hz
Dielectric Strength 440 V/mil
@Thickness 3.17 mm
 
Thermal PropertiesOriginal ValueComments
CTE, linear 50.0 - 55.0 µm/m-°C
Maximum Service Temperature, Air 250 °F
Minimum Service Temperature, Air -65.0 °F
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 - 3.00 hour
@Temperature 93.3 °C
 24.0 - 48.0 hour
@Temperature 23.9 °C
Working Life 60.0 - 75.0 minAfter mixing, 100 g batch
Shelf Life 6.00 Month
@Temperature <=23.9 °C
in original, unopened containers
 
Compliance PropertiesOriginal ValueComments
USP Class VI Yes
 
Descriptive Properties
Mixing Ratio1:1 by weightParts A to B

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PMASTM827 / 185420

USP Class VI adhesives

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