Epoxy Technology EPO-TEK® T7109-17 Thermally Conductive Epoxy

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Epoxy Technology EPO-TEK® T7109-17 Thermally Conductive Epoxy
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes:	Product Description: EPO-TEK® T7109-17 is a flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications within the semiconductor, hybrid, electronic and optical industries. It is a replacement for EPO-TEK® T7109-14. Advantages & Application Notes: Suggested applications: Hybrids: bonding thermo-electric coolers (TEC’s) Power devices: adhesive for low-stress bonding of ferrites; laminating Cu foils to substrates Optics: Die-attaching µ-LCDs to PCB/substrate Flexible potting of kapton flex PCB containing µ-LCD into the frame Adhesive for OEM optics including profilometry Semiconductor: glob top over IC and wire bonds General: adhesive for Al, Cu, Kovar, ceramic, glass, PCBs, and most plastics Rheology allows deposition by hand, dispensers or screen printers. Information Provided by Epoxy Technology
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Physical Properties	Original Value	Comments

Specific Gravity	1.08 g/cc	Part B
	1.34 g/cc	Part A
Particle Size	<= 20 µm
Viscosity	30000 - 70000 cP @Temperature 23.0 °C	5 rpm

Mechanical Properties	Original Value	Comments
Hardness, Shore D	83
Tensile Modulus	2600 psi	Storage
Shear Strength	574 psi	Lap
	>= 952 psi	Die

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 1.00e+10 ohm-cm
Dielectric Constant	6.1 @Frequency 1000 Hz
Dissipation Factor	0.146 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	48.0 µm/m-°C	Below Tg
	181 µm/m-°C	Above Tg
Thermal Conductivity	0.500 W/m-K
Maximum Service Temperature, Air	150 °C	Continuous
	250 °C	Intermittent
Minimum Service Temperature, Air	-55.0 °C	Continuous
	-55.0 °C	Intermittent
Glass Transition Temp, Tg	>= 20.0 °C	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature	317 °C	Degradation Temperature

Processing Properties	Original Value	Comments
Cure Time	2.00 hour @Temperature 80.0 °C	Minimum Bond Line
	48.0 hour @Temperature 23.0 °C	Minimum Bond Line
Pot Life	120 min
Shelf Life	12.0 Month @Temperature 25.0 °C

Descriptive Properties
Color	Clear/Colorless	Part B
	Gray	Part A
Consistency	Smooth paste
Mix Ratio by Weight	10:3
Number of Components	Two
Weight Loss	0.67%	200°C
	1.15%	250°C
	3.14%	300°C

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PPOXYT093 / 141132

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