| Product Description: EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally insulating epoxy. Advantages & Application Notes: - Extended pot-life of many days which allows low waste between manufacturing shifts.
- Built-in color change upon cure. Users can determine cure by visual means due to a red-amber color change from slight yellow.
- Suggested Applications:
- Semiconductor: capillary underfill below flip chip mounted die or SMDs.
- Opto-electronic: %Transmission in the IR from 800 – 2000 nm range, adhesion to Si, glass, ceramic and metals.
- Fiber Optic: sealing fiber into ferrules, optical connectors, adhesion to quartz, Au, kovar, stainless steel, packaging of Fiber Optic components.
- Medical: resisting autoclave steam sterilization cycles in fiber optic bundles, adhesion to most plastics.
- Designed to be a longer pot-life alternative to EPO-TEK® 353ND, it may be used in similar applications and devices.
- Capable of being syringe dispensed in mass production. It’s medium viscosity lends itself to adhesive, sealing, potting and encapsulation.
- Complies with USP Class VI biocompatibility standards.
Information Provided by Epoxy Technology |
