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Flame Retardant adhesives

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Sumitomo Bakelite North America 2004B Glass Reinforced Hardware Grade Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Molded, Glass Fiber Filler; Filled/Reinforced Thermoset

Material Notes: Epoxy is the premier material for military firewall connectors.

Information provided by Sumitomo Bakelite North America, Inc.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 2.00 g/ccASTM D792
Water Absorption 0.15 %48 hours, 50°C. ASTM D570
Linear Mold Shrinkage 0.0010 - 0.0030 cm/cmCompression Molding. ASTM D955
 
Mechanical PropertiesOriginal ValueComments
Hardness, Barcol 72
Tensile Strength, Ultimate 62.0 MPaASTM D638
Flexural Yield Strength 138 MPaASTM D790
Flexural Modulus 16.5 GPaASTM D790
Compressive Yield Strength 207 MPaASTM D695
Izod Impact, Notched 0.370 J/cmASTM D256A
 
Electrical PropertiesOriginal ValueComments
Dielectric Constant 4.0Wet; ASTM D150
Dielectric Strength 11.0 kV/mmWet, short term. ASTM D149
Dissipation Factor 0.019
@Frequency 1e+6 Hz
Wet; ASTM D150
Arc Resistance 170 secASTM D495
 
Thermal PropertiesOriginal ValueComments
CTE, linear, Parallel to Flow 33.0 µm/m-°C
@Temperature 20.0 °C
ASTM D696
Thermal Conductivity 0.607 W/m-KASTM F433
Maximum Service Temperature, Air 130 °CUL temperature Index, UL 746B
Deflection Temperature at 1.8 MPa (264 psi) 282 °CASTM D648A
UL RTI, Electrical 130 °CUL 746B
UL RTI, Mechanical with Impact 130 °CUL 746B
UL RTI, Mechanical without Impact 130 °CUL 746B
Flammability, UL94 V-0
@Thickness 1.60 mm
Oxygen Index >= 50 %ASTM D2863
 
Processing PropertiesOriginal ValueComments
Mold Temperature 143 - 177 °Ccompression/transfer molding.
 174 - 182 °Cinjection molding.

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PROG63 / 66274

Flame Retardant adhesives

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