Bakelite® PF 7590 Phenolic Molding Compound

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Bakelite® PF 7590 Phenolic Molding Compound
Categories:	Polymer; Thermoset; Phenolic
Material Notes:	Phenolic molding compound, inorganically/organically filled, modified with graphite, good heat conductivity, good sliding properties (Not suitable for use of higher voltage). Applications: modified with graphite, good heat conductivity, good sliding properties, high dimension stability, grinding wheels
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Physical Properties	Original Value	Comments

Density	1.66 g/cc	ISO 1183
Apparent Bulk Density	0.750 g/cc	ISO 60
Linear Mold Shrinkage	0.0030 cm/cm	Compression Molding. Post Shrinkage = 0.1%.; ISO 2577

Mechanical Properties	Original Value	Comments
Flexural Strength	90.0 MPa	ISO 178
Flexural Modulus	11500 MPa	ISO 178
Charpy Impact Unnotched	5.00 kJ/m²	ISO 179-1 eU
Charpy Impact, Notched	1.40 kJ/m²	ISO 179-1eA

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+11 ohm-cm
Surface Resistance	1.00e+10 ohm
Dielectric Constant	15 @Frequency 100 Hz
Dissipation Factor	0.080 @Frequency 100 Hz

Thermal Properties	Original Value	Comments
Deflection Temperature at 8.0 MPa	160 °C	ISO 75-2

Descriptive Properties
Water absorption (mg)	8	24h / 23°C

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PBAKE990 / 192352

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