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Master Bond adhesives

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Avient Stat-Tech™ X ST6600-0040 ES FR Black Polyamide 66 (Nylon 66)
Categories: Polymer; Thermoplastic; Nylon (Polyamide PA); Nylon 66 (PA66)

Material Notes: Stat-Tech™ Electrically Conductive Compounds are specifically engineered to provide anti-static, ESD and RFI/EMI shielding performance for critical electronic equipment applications. These compounds combine the performance of select engineering resins with reinforcing additives such as carbon powder, carbon fiber, nickel-coated carbon fiber and stainless steel fiber for low to high levels of conductivity depending upon application requirements.

Information provided by PolyOne

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.22 g/ccASTM D792
Filler Content 40 %Carbon Fiber Reinforcement
Linear Mold Shrinkage, Flow 0.0010 - 0.0020 cm/cmASTM D955
Linear Mold Shrinkage, Transverse 0.017 - 0.018 cm/cmASTM D955
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength at Break 169 MPaASTM D638
Elongation at Break 0.42 %Type I, 5.1 mm/min; ASTM D638
Flexural Strength 322 MPaASTM D790
Flexural Modulus 23500 MPaASTM D790
Izod Impact, Notched 69.0 J/m
@Thickness 3.18 mm,
Temperature 23.0 °C
Injection Molded; ASTM D256A
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 10 - 1000 ohm-cmASTM D257
Surface Resistance 100 - 10000 ohmASTM D257
Static Decay 0.0020 sec(Mil-B-81705C), 12% RH, 5000kV to 50kV
Shielding Effectiveness 42 dB
@Frequency 1e+9 Hz
1/8 thickness
 54 dB
@Frequency 5.00e+9 Hz
1/8 thickness
 68 dB
@Frequency 1e+10 Hz
1/8 thickness
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 0.46 MPa (66 psi) >= 245 °CUnannealed; ASTM D648
Flammability, UL94 V-0Internal Method; UL 94
 
Processing PropertiesOriginal ValueComments
Drying Temperature 71.1 - 82.2 °C
 
Descriptive Properties
FeaturesGood Chemical Resistance
 High Stiffness
 Semi Crystalline
FormsPellets
Generic MaterialNylon 66
Generic NamePolyamide 66 (Nylon 66)
Processing MethodInjection Molding
Regional AvailabilityAfrica & Middle East
 Asia Pacific
 Europe
 North America
 South America
UsesAerospace Applications
 Business Equipment
 Computer Components
 Connectors
 Electrical/Electronic Applications

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