| Product Description: EPO-TEK® 930-4 is a two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe. Advantages & Application Notes: - Recommended for applications where heat dissipation and insulating properties are essential; attaching heat sinks on PCB; heat-sinking in hybrids such as DIP or TO-cans; kovar, aluminum or ceramic packaging.
- Semiconductor applications: die-attach inside plastic IC packages using JEDEC format; die bonding power devices; thermally conductive underfill and glob top for flip-chip assembled die.
- Adhesion to ferrous and non-ferrous metals, ceramic, glass, semiconductor materials and most plastics is excellent.
- Designed for many production methods such as screen printing techniques, automated dispensing, pin transfer or manual applications by hand or spatula.
- Ease of use: long pot-life with low temperature cure of 80°C possible.
- Color change characteristic that indicates the epoxy has reached optimum cure - it goes from an off-white color to an amber color - depending on cure cycle and epoxy thickness.
Information Provided by Epoxy Technology |
