Product Highlights:- Superior thermal conductivity
- Very low coefficient of thermal expansion
- Phenomenal dimensional stability
- Excellent flow properties
- Outstanding electrical insulation properties
- Long working life
Kohesi Bond KB 1040 AO-1LP is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. It offers high thermal conductivity and offers a very long working life. Its stellar heat transfer capabilities and flow characteristics make it fitting for potting applications. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1040 AO-1LP can withstand severe thermal cycling and provides superior physical strength properties and dimensional stability. It offers an extensive service temperature range of -50°C to +120°C. KB 1040 AO-1LP adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. It also offers excellent chemical resistance to a variety of fuels, oils and water. Part A has a gray color and Part B has a clear color. Owing to its Excellent performance and vacuum compatibility KB 1040 AO-1LP is widely used in aerospace, electronics and related industries. Typical Applications: - Bonding
- Sealing
- Coating
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |
