Resinlab® EP965SC-7 Clear Unfilled Electronic Grade Epoxy Encapsulant

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Resinlab® EP965SC-7 Clear Unfilled Electronic Grade Epoxy Encapsulant
Categories:	Polymer; Thermoset; Epoxy; Epoxy Cure Resin; Epoxy Encapsulant, Unreinforced
Material Notes:	Resinlab™ EP965SC-7 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release and a smooth high gloss surface. It has very good resistance to water, acids and bases and most organic solvents. It was especially formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP965SC-7 Clear will reach full cure at room temperature within 24 hours. Cure time can be accelerated by the application of heat after product has gelled. Times and temperatures from 1 hour at 65°C to 20 minutes at 110°C are typical for small castings (less than 50 grams). Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
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Physical Properties	Original Value	Comments

Specific Gravity	0.980 g/cc	Part B; TM R050-16
	1.07 g/cc	Mixed; TM R050-16
	1.16 g/cc	Part A; TM R050-16
Water Absorption	0.43 % @Time 86400 sec	TM R050-35
Viscosity	3000 cP	Part B, RVT, #5, 20 rpm; TM R050-12
	8000 cP	Mixed; TM R050-12
	16000 cP	Part A, RVT, #6, 20 rpm; TM R050-12

Mechanical Properties	Original Value	Comments
Hardness, Shore D	80	TM R050-17
Tensile Strength at Break	6800 psi	TM R050-36
Tensile Strength, Ultimate	7500 psi	TM R050-36
Tensile Strength, Yield	4000 psi	TM R050-36
Elongation at Break	3.0 - 6.0 %	TM R050-36
Tensile Modulus	375 ksi	TM R050-36
Compressive Yield Strength	8500 psi	TM R050-38
Compressive Strength	21500 psi	Ultimate; TM R050-38
	21500 psi	Break; TM R050-38
Compressive Modulus	200 ksi	TM R050-38
Adhesive Bond Strength	2500 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37

Electrical Properties	Original Value	Comments
Volume Resistivity	8.00e+14 ohm-cm
Dielectric Constant	4.2 @Frequency 100 Hz, Temperature 25.0 °C
Dielectric Strength	410 V/mil

Thermal Properties	Original Value	Comments
CTE, linear	50.0 µm/m-°C
Thermal Conductivity	0.140 W/m-K
Maximum Service Temperature, Air	150 °C
Minimum Service Temperature, Air	-40.0 °C
Glass Transition Temp, Tg	68.0 °C	TM R050-25

Optical Properties	Original Value	Comments
Transmission, Visible	90 %	clear; thickness not quantified

Processing Properties	Original Value	Comments
Pot Life	45 - 60 min	Mass: 50g; TM R050-19

Descriptive Properties
Color	Clear
Mix Ratio	1:1	Volume
	100:85	Weight

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