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Elmet Technologies

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UBE UPILEX 75S (75 micron) Polyimide Film
Categories: Polymer; Film; Thermoset; Polyimide, TS; Polyimide, Thermoset Film

Material Notes: Description: UPILEX, the ultra-high heat-resistant polyimide film, is the product of the polycondensation reaction between biphenyltetracarboxylic dianhydride (BPDA), of which process Ube Industries originally developed, and diamine. Most notable of these characteristics is UPILEX's physical, mechanical, electrical, and chemical properties under high-temperature conditions.

UPILEX-S demonstrates outstanding mechanical characteristics through a wide temperature range. UPILEX-S displays high tensile strength and modulus, and also features outstanding long-term heat resistance. Another advantage inherent in UPILEX-S is its high resistance to hydrolysis, as its properties are practically unaffected, even by immersion in boiling water for long periods of time.

Information provided by UBE.

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Physical PropertiesOriginal ValueComments
Density 1.47 g/ccASTM D1505
 
Mechanical PropertiesOriginal ValueComments
Film Tensile Strength at Yield, MD 107.9 MPa200°C (Stress at 5% Elongation (MD)); ASTM D882
 205.9 MPa25°C (Stress at 5% Elongation (MD)); ASTM D882
Film Elongation at Break, MD 50 %25°C; ASTM D882
 80 %200°C; ASTM D882
Flex Crack Resistance >= 25000Cycles Fold Endurance (MIT); ASTM D2176
Secant Modulus, MD 3.82 GPa200°C; ASTM D882
 6.96 GPa25°C; ASTM D882
Coefficient of Friction, Dynamic 0.4025°C, film to film; ASTM D1894
Tear Strength Test 30kg/mm, 25°C Tear Strength-Initiation [Graves] (MD); ASTM D1004
 430g/mm, 25°C, Tear Strength-Propagation [Elmendorf] (MD); ASTM D1922
Film Tensile Strength at Break, MD 274.6 MPa200°C; ASTM D882
 362.8 MPa25°C; ASTM D882
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+16 ohm-cm
@Temperature 25.0 °C
DC100V; ASTM D257
 1.00e+16 ohm-cm
@Temperature 200 °C
DC100V; ASTM D257
Surface Resistance 1.00e+15 ohm
@Temperature 200 °C
DC100V; ASTM D257
 >= 1.00e+16 ohm
@Temperature 25.0 °C
DC100V; ASTM D257
Dielectric Constant 3.3
@Frequency 1000 Hz
ASTM D150
 3.2
@Frequency 1000 Hz,
Temperature 200 °C
ASTM D150
Dielectric Strength 150 kV/mm
@Temperature 25.0 °C
50Hz, 75µm; ASTM D149
 150 kV/mm
@Temperature 200 °C
50Hz, 75µm; ASTM D149
Dissipation Factor 0.0038
@Frequency 1000 Hz
ASTM D150
 0.0056
@Frequency 1000 Hz,
Temperature 200 °C
ASTM D150
 
Thermal PropertiesOriginal ValueComments
CTE, linear 20.0 µm/m-°C
@Temperature 20.0 - 200 °C
Values determined by minute linear expansion tester at 5°C/min. temperature increments
Specific Heat Capacity 1.13 J/g-°CDifferential Scanning Calorimeter
Thermal Conductivity 0.000690 cal cm/sec-cm²-°CLaser Flash Method
Maximum Service Temperature, Air 290 °CHeat Treatment: 20,000 Hours
Glass Transition Temp, Tg >= 500 °C
Flammability, UL94 V-0VTM
Oxygen Index 66 %JIS K7201
Shrinkage 0.010 %
@Temperature 200 °C,
Time 7200 sec
JIS C2318
 
Descriptive Properties
Resistance to Organic SolventsExcellent
Resistance to Strong AcidsGood
Resistance to Strong AlkalisGood

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PUBE236 / 71794

Ensinger PEI

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