Appearance: Gray Filler Type: Silver Cure: Heat cure Product Benefits: - Electrically conductive
- Thermally conductive
- Good dispensing characteristics
- Hydrophobic
- Stable at high temperatures
- Low moisture absorption
- Excellent adhesion
- Low stress
- Thermally stable at 260ºC reflow
- Passes NASA outgassing
- Passes MIL STD 883, Method 5011
Application: Die attach LOCTITE ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications. LOCTITE ABLESTIK QMI529HT-LV passes NASA outgassing standards. LOCTITE ABLESTIK QMI529HT-LV passes MIL-STD-883 standards, Method 5011. Information provided by Loctite® |