- Formulated for wire tinning, component tinning, and wave soldering/spray flux applications
- Excellent for tinning of insulated and braided wire and solder coating of printed circuit boards
- Contains no rosins or resins
- Meets all of the requirements of Bellcore TR-NWT-000078, Issue 3, December, 1991
- IPC, ANSI J-STD-004, Type ORL0.
Description: Superior No. 334 No-Clean flux is specially formulated for automated and manual wire tinning applications, and for spray flux application in wave soldering. Superior No. 334 is an alcohol-based No-Clean flux that has excellent activity levels and affords a wide process window for a No-Clean flux. The post-solder residue exceeds the minimum Bellcore and IPC requirements for cleanliness and provides long-term reliability for critical connections and components.Applications: Superior No. 334 flux is formulated for all applications as supplied, and may be applied to parts in waterfall, dipping, or spraying processes. With extended use, the flux solids level increases causing the acid number to increase. Flux activity levels should be monitored and maintained using a titration kit. Add Superior No. 95T thinner to maintain proper acid number. Information provided by Superior Flux |