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Materion Brush 60™ HT
Categories: Metal; Nonferrous Metal; Beryllium Alloy; Copper Alloy

Material Notes: Information supplied by Brush Wellman Engineered Materials.

Treatment required for max strength: Mill Hardened
Stress Relaxation-% Stress Remaining after 1000 hrs @ 100°C: 96%
Stress Relaxation after 1000 hrs @ 200°C: 75%
Formability Ratio, 90° Bend, Radius/Thickness (Good Way): 1.5
Formability Ratio (bad Way): 1.5
Superficial Hardness: 30T 82-89

Brush 60™ is a new generation, high conductivity copper beryllium alloy which is specifically engineered to meet the stringent electrical and mechanical requirements of computer, datacom, and telecommunications applications. Performance benefits include:

  • Signal reliability
  • Durability
  • Design flexibility
  • Manufacturability
  • Recyclability

Brush Engineered Materials Inc. changed its name to Materion Corporation in March 2011.

Key Words: UNS C17460
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Physical PropertiesOriginal ValueComments
Density 8.80 g/cc
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell B 99 - 106
Tensile Strength, Ultimate 825 - 965 MPa
Tensile Strength, Yield 720 - 860 MPa
Elongation at Break >= 10 %
Modulus of Elasticity 138 GPa
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity <= 0.00000340 ohm-cm>5% IACS conductivity
 
Thermal PropertiesOriginal ValueComments
CTE, linear 18.0 µm/m-°C
@Temperature 20.0 - 200 °C
Thermal Conductivity 221 W/m-K
Melting Point 1030 - 1080 °C
Solidus 1030 °C
Liquidus 1080 °C
 
Component Elements PropertiesOriginal ValueComments
Beryllium, Be 0.15 - 0.50 %
Copper, Cu 98.1 %as balance
Nickel, Ni 1.0 - 1.4 %
Tin, Sn <= 0.25 %
Zirconium, Zr <= 0.50 %

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NBB261 / 15118

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