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Chemically Resistant adhesives

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Epoxy Technology EPO-TEK® H61ND Thermally Conductive, Electrically Insulating Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: Material Description: A single component, high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications.

Information Provided by Epoxy Technology

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Physical PropertiesOriginal ValueComments
Specific Gravity 2.27 g/cc
Particle Size <= 50 µm
Viscosity 30000 - 50000 cP
@Temperature 23.0 °C
5 rpm
 
Chemical PropertiesOriginal ValueComments
Ionic Impurities - Na (Sodium) 142 ppm
Ionic Impurities - K (Potassium) 17 ppm
Ionic Impurities - Cl (Chloride) 90 ppm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 83
Tensile Modulus 893000 psiStorage
Shear Strength 506 psiLap
 >= 6800 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 3.00e+13 ohm-cm
Dielectric Constant 4.23
@Frequency 1000 Hz
Dissipation Factor 0.0030
@Frequency 1000 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 22.0 µm/m-°CBelow Tg
 86.0 µm/m-°CAbove Tg
Thermal Conductivity 0.800 W/m-K
Maximum Service Temperature, Air 200 °CContinuous
 300 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 100 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 468 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Cure Time 30.0 min
@Temperature 150 °C
minimum
 60.0 min
@Temperature 120 °C
minimum
Pot Life 28800 min
Shelf Life 6.00 Monthrefrigerated
 
Descriptive Properties
ColorLight gray
ConsistencySmooth paste
Ionic Impurities NH4392 ppm
Number of ComponentsSingle
Thixotropic Index1.3
Weight Loss0.08%200°C
 0.14%250°C
 0.24%300°C

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PPOXYT064 / 141103

Chemically Resistant adhesives

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