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Elmet Technologies

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Epoxy Technology EPO-TEK® B9021 Epoxy Paste
Categories: Polymer; Thermoset; Epoxy

Material Notes: Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach. It can be used as the main gasket seal of glass plates in LCDs or sealing filter windows onto opto-sensors.

Information Provided by Epoxy Technology

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.35 g/cc
Particle Size <= 20 µm
Viscosity 4000 - 8000 cP
@Temperature 23.0 °C
50 rpm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 76
Tensile Modulus 230000 psiStorage
Shear Strength 986 psiLap
 1360 psiDie
 
Thermal PropertiesOriginal ValueComments
CTE, linear 36.0 µm/m-°CBelow Tg
 57.0 µm/m-°CAbove Tg
Maximum Service Temperature, Air 160 °CContinuous
 260 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 60.0 °C
Decomposition Temperature 313 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Dry Time <= 24.0 hour
Cure Time 30.0 min
@Temperature 75.0 °C
minimum, B-stage
Pot Life 40320 min
Shelf Life 12.0 Monthrefrigerated
 
Descriptive Properties
ColorWhitebefore cure
ConsistencySmooth paste
Number of ComponentsSingle
Weight Loss3.77%200°C
 4.41%250°C
 7.97%300°C

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PPOXYT154 / 141193

Ensinger PEI

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