Henkel Loctite® 3128 Epoxy

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Henkel Loctite® 3128 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance (uncured): Black viscous liquid LMS Components: One component - requires no mixing Viscosity: Medium Cure: Heat cure (low temperature) Application: Bonding heat sensitive components Information provided by Loctite®
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Physical Properties	Original Value	Comments

Specific Gravity	1.60 g/cc
Water Absorption	0.17 % @Time 86400 sec	ISO 62
Viscosity	7000 - 27000 cP	Casson, Cone & Plate Rheometer
	44000 cP	Yield Point, Cone & Plate Rheometer
Outgassing - Total Mass Loss	0.080 %	WVR, NASA Outgassing
	0.40 %	TML, NASA Outgassing
Collected Volatile Condensable Material	<= 0.010 %	NASA Outgassing

Mechanical Properties	Original Value	Comments
Hardness, Shore D	45	ISO 868
Tensile Strength at Break	35.0 MPa	ISO 527-3
Elongation at Break	2.3 %	ISO 527-3
Tensile Modulus	3900 MPa	ISO 527-3
Shear Strength	>= 7.00 MPa	Lap, Cured for 30 minutes @ 80 °C, Epoxyglass (thickness 1.6 mm)
	21.0 MPa	Lap, Cured for 30 minutes @ 80 °C, Steel (grit blasted)

Electrical Properties	Original Value	Comments
Volume Resistivity	2.90e+16 ohm-cm
Dielectric Constant	5.1 @Frequency 1e+7 Hz	IEC 60250
	5.4 @Frequency 1e+6 Hz	IEC 60250
	5.8 @Frequency 10000 Hz	IEC 60250
Dissipation Factor	0.010 @Frequency 10000 Hz
	0.040 @Frequency 1e+6 Hz
	0.050 @Frequency 1e+7 Hz

Thermal Properties	Original Value	Comments
CTE, linear	40.0 µm/m-°C	Cured, alpha 1
	130 µm/m-°C	Cured, alpha 2
Glass Transition Temp, Tg	45.0 °C	via TMA; ISO 11359-2
Shrinkage	0.010 %	Linear; ASTM D 792
	3.1 %	Volume; ASTM D 792

Processing Properties	Original Value	Comments
Cure Time	20.0 min @Temperature 80.0 °C	bondline temperature
	60.0 min @Temperature 60.0 °C	bondline temperature
Shelf Life	12.0 Month @Temperature -25.0 - -15.0 °C

Descriptive Properties
Pot Life	3 weeks

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PLOCT5100 / 255311

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