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Chemically Resistant adhesives

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Epoxy Technology EPO-TEK® 921 Thermally Conductive Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: Material Description: A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound.

Information Provided by Epoxy Technology

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.02 g/ccPart B
 2.45 g/ccPart A
Particle Size <= 50 µm
Viscosity 20000 - 40000 cP
@Temperature 23.0 °C
10 rpm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 93
Tensile Modulus 1.036e+6 psiStorage
Shear Strength 1808 psiLap
 >= 6800 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 8.00e+13 ohm-cm
Dielectric Constant 6.4
@Frequency 1000 Hz
Dissipation Factor 0.0090
@Frequency 1000 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 26.0 µm/m-°CBelow Tg
 97.0 µm/m-°CAbove Tg
Thermal Conductivity 1.40 W/m-K
Maximum Service Temperature, Air 200 °CContinuous
 300 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 90.0 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 356 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Cure Time 5.00 min
@Temperature 150 °C
minimum
 10.0 min
@Temperature 120 °C
minimum
 20.0 min
@Temperature 100 °C
minimum
Pot Life 360 min
Shelf Life 6.00 Month
@Temperature 25.0 °C
 
Descriptive Properties
ColorAmberPart B
 GreyPart A
ConsistencySmooth thixotropic paste
Mix Ratio by Weight100:2.2
Number of ComponentsTwo
Thixotropic Index2.5
Weight Loss0.11%200°C
 0.2%250°C
 0.45%300°C

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PPOXYT055 / 141094

Chemically Resistant adhesives

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