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Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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Tin-Lead Eutectic Solder (63Sn-37Pb), Drop Solder (UNS L13630)
Categories: Metal; Nonferrous Metal; Solder/Braze Alloy; Tin Alloy

Key Words: AMS 4751 ASTM B32 (63A, Sn63) FED QQ-S-571 (Sn63)
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Physical PropertiesOriginal ValueComments
Density 8.40 g/cc
Viscosity 1.33 cP
@Temperature 280 °C
Dynamic viscosity
 45600 cP
@Temperature 280 °C
Surface Tension 490 dynes/cm
@Temperature 280 °C
 
Mechanical PropertiesOriginal ValueComments
Hardness, Brinell 14Cast
Tensile Strength, Ultimate 52.0 MPaCast solder. Typical Cu joint is 200 MPa.
Tensile Strength, Yield 43.0 MPa
Elongation at Break 32 %in 100 mm, Cast
Modulus of Elasticity 32.0 GPaInterpolated
Poissons Ratio 0.38
Shear Modulus 12.0 GPaCalculated
Shear Strength 37.0 MPaTypical soldered Cu joint is 55 MPa.
Izod Impact 20.0 JCast
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.0000145 ohm-cm
 
Thermal PropertiesOriginal ValueComments
Heat of Fusion 37.0 J/g
CTE, linear 24.7 µm/m-°C
@Temperature 15.0 - 110 °C
Thermal Conductivity 50.9 W/m-K
@Temperature 0.000 - 180 °C
Melting Point 183 °C
Solidus 183 °C
Liquidus 183 °C
 
Component Elements PropertiesOriginal ValueComments
Aluminum, Al <= 0.0050 %
Antimony, Sb <= 0.12 %
Arsenic, As <= 0.030 %
Bismuth, Bi <= 0.25 %
Copper, Cu <= 0.080 %
Iron, Fe <= 0.020 %
Lead, Pb 37 %
Tin, Sn 63 %
Zinc, Zn <= 0.0050 %

References for this datasheet.

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MLS13630 / 205642

solder replacement adhesives

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