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Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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Superior Flux Superior No. 97 Non-Activated Rosin Flux, Type R
Categories: Metal; Nonferrous Metal; Solder/Braze Alloy

Material Notes:
  • A non-activated rosin flux for general-purpose soldering of PCB's, wire, cable, and semiconductors, and hand soldering applications.
  • Excellent for a variety of metals including copper, gold, nickel alloys, silver, and tin.
  • Can be used for automated and manual soldering operations.
  • Flux conforms to IPC-ANSI-J-STD-004, Type ROLO.
Description: Superior No. 97 Type R Flux consists of a homogeneous solution of water-white rosin in an alcohol-base. It is completely free of any activators and leaves a non-corrosive, non-conductive, fungus-proof post-solder residue. The flux is widely used in electronic applications requiring excellent soldering activity and yielding residues with no potential for corrosion. Superior No. 97 Type R Flux becomes active above 175°C/340°F, attaining peak activity in the temperature range 200-260°C/390-500°F, where it promotes excellent solderability. It can also be used for high-temperature soldering applications, such as mag-wire tinning at temperatures in the 400-430°C/750-800°F range.

Applications: Superior No. 97 Type R Flux is an excellent choice for soldering printed circuit boards (PCBs), wire leads, cables, and component tinning. Superior No. 97 Type R Flux can be used to solder many different metals and alloys including copper, brass, and other metals commonly used in electronics applications.

Information provided by Superior Flux

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Physical PropertiesOriginal ValueComments
Specific Gravity 0.8835 - 0.900 g/cc
Density 6.74 - 8.14 lb/gal
Solids Content 38 - 42 %
 
Thermal PropertiesOriginal ValueComments
Boiling Point 85.0 °C
Flash Point 12.0 °CTCC Method
 
Processing PropertiesOriginal ValueComments
Processing Temperature 200 - 260 °CSoldering Range
Shelf Life 2.00 Month
 
Descriptive Properties
FormLight Brown Liquid
ResiduesNon-Corrosive, Non-Conductive
Spread Factor>80

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solder replacement adhesives

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