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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

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Epoxy Technology EPO-TEK® 730 General Purpose Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Product Description: EPO-TEK® 730 is a two component, thixotropic, room temperature-curing epoxy adhesive.

Advantages & Application Notes:

  • Excellent all purpose adhesive. Many uses in job shop and repair businesses, home or household, outdoor, recreation, camping, automotive, boating; and industrial use such as filtration and metal working.
  • Designed for those applications where a limited amount of flow is desirable. Capillary forces do not pull the epoxy out of alignment.
  • The paste-like appearance allows it to be spread by hand using a spatula or blade, by dispensing equipment, or specialty packaging.
  • The 1:1 mix ratio allows it to be easily mixed by volume or by weight.
  • Used in the fabrication of X-ray sensors. Adheres to metal foils and substrates, especially lead.
  • Available in black and in different viscosities.
  • Excellent adhesion to foam/plastics; especially those used in filtration applications.
  • Medical grade suggested applications:
    • Has passed the requirements of USP Class VI Biocompatibility Standards for implantation devices.
    • Excellent adhesion to stainless steel. Suitable for adhesive and sealing.
  • Suggested for LCD plug-seal or end-seal, due to its high viscosity nature and room temperature cure.
  • Can be used for joining SMDs to PCB, for staking applications, or double sided PCB. It has wet, ?green strength? before cure. In many cases, the thixotropic nature of the adhesive will hold parts in place without special fixtures while the hardening process is taking place.
  • Very popular epoxy for wood-working applications.
  • Versatility in curing options between 23°C and 100°C

Information Provided by Epoxy Technology

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 0.940 g/ccPart B
 1.12 g/ccPart A
Particle Size <= 20 µm
Viscosity 80000 - 120000 cP
@Temperature 23.0 °C
2.5 rpm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 64
Tensile Modulus 124000 psiStorage
Shear Strength >= 2000 psiLap
 >= 3400 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity <= 3.00e+13 ohm-cm
Dielectric Constant 3.17
@Frequency 1000 Hz
Dissipation Factor 0.021
@Frequency 1000 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 66.0 µm/m-°CBelow Tg
 248 µm/m-°CAbove Tg
Maximum Service Temperature, Air 150 °CContinuous
 250 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 55.0 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 367 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Cure Time 24.0 hour
@Temperature 23.0 °C
Minimum Bond Line
 30.0 min
@Temperature 100 °C
Minimum Bond Line
Pot Life 60 min
Shelf Life 12.0 Month
@Temperature 25.0 °C
 
Compliance PropertiesOriginal ValueComments
USP Class VI Yes
 
Descriptive Properties
ColorTanPart A
 TanPart B
ConsistencySmooth paste
Mix Ratio by Weight1:1
Number of ComponentsTwo
Thixotropic Index2.1
Weight Loss1.41%200°C
 2.22%250°C
 4.16%300°C

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PPOXYT149 / 141188

USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

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