| Product Description: EPO-TEK® H72 is a two component, high Tg, thermally conductive and electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. Advantages & Application Notes: - Suggested applications:
- Semiconductor/PCB: heat sinking, adhesion to Al, Cu, Al2O3; extra mechanical protection for SMDs.
- Hybrids: substrate attach of ceramic circuit to package. Underfill below SMDs; staking large tantalum caps to ceramic substrates, lid sealing.
- Opto-electronics: sensor devices, sealing ferrule or fiber optic feed through, replacement of eutectic lid seal.
- Passes NASA low outgassing standard ASTM E595 with proper cure
- Paste-like rheology allows for application by syringe dispensing, screen printing, pin transfer or by hand.
- Built in color change - from grey to amber - when cured properly.
- Possible to be snap cured in less than 5 minutes, at relatively low temperature.
- Alumina filler allows a toughened epoxy formulation that is very robust and high temperature resistant.
- Highly resistant to most chemicals and solvents.
Information Provided by Epoxy Technology |
