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Chemically Resistant adhesives

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Cosmic Plastics E4930 Mineral & Glass Filled Epoxy Molding Compound, Encapsulated Grade  (discontinued **)
Categories: Polymer; Thermoset; Epoxy; Epoxy, Encapsulating, Glass or Mineral Filled; Filled/Reinforced Thermoset

Material Notes:

Data provided by the manufacturer.

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Physical PropertiesOriginal ValueComments
Density 2.00 g/cc
Apparent Bulk Density 0.800 g/cc
Water Absorption 0.25 %48 hrs, 50°C
Linear Mold Shrinkage 0.0010 - 0.0040 cm/cmtypical.
 
Mechanical PropertiesOriginal ValueComments
Hardness, Barcol 65
Tensile Strength, Ultimate 83.0 MPa
Flexural Strength 103 MPa
Flexural Modulus 14.0 GPa
Compressive Strength 193 MPa
Izod Impact, Notched 0.320 J/cm
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 1.00e+15 ohm-cm
Surface Resistance 1.00e+15 ohm
Dielectric Constant 4.2
@Frequency 1000 Hz
Wet
 4.5
@Frequency 1e+6 Hz
Wet
Dielectric Strength 14.0 kV/mmWet, Step by Step
Dissipation Factor 0.011
@Frequency 1e+6 Hz
Wet
 0.012
@Frequency 1000 Hz
Wet
Arc Resistance 180 sec
 
Thermal PropertiesOriginal ValueComments
CTE, linear 25.0 µm/m-°C
@Temperature 20.0 °C
Alpha 1
CTE, linear, Transverse to Flow 80.0 µm/m-°C
@Temperature 20.0 °C
Alpha 2
Thermal Conductivity 1.2561 W/m-K
Deflection Temperature at 1.8 MPa (264 psi) >= 200 °C
Glass Transition Temp, Tg 165 °C
 
Processing PropertiesOriginal ValueComments
Processing Temperature 150 - 175 °CMolding temperature

**
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PAESCW / 22955

Chemically Resistant adhesives

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