NextGen Adhesives TC907-09 Thermally Conductive Adhesive

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NextGen Adhesives TC907-09 Thermally Conductive Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Description: NGAC TC907-09 is a medium viscosity, electrically insulating and room temperature curing adhesive designed for staking and setting heat sensitive components in printed circuit board applications. Advantages and Applications: NGAC TC907-09 provides strong and high impact bonds which improve heat transfer while maintaining electrical insulation. It bonds to a wide range of substrates including metals, glass and plastics. The NGAC TC907-09 has a low coefficient of thermal expansion and will provide excellent resistance to mismatched substrates and very low shrinkage. Additionally, the NGAC TC907-09 is highly resistant to chemicals. Information Provided by Nextgen Adhesives
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Physical Properties	Original Value	Comments

Specific Gravity	1.70 g/cc
Solids Content	100 %
Viscosity	13000 cP

Mechanical Properties	Original Value	Comments
Hardness, Shore D	90

Thermal Properties	Original Value	Comments
CTE, linear	50.9 µm/m-°C
Thermal Conductivity	0.560 W/m-K
Maximum Service Temperature, Air	125 °C
Minimum Service Temperature, Air	-70.0 °C
Glass Transition Temp, Tg	120 °C

Processing Properties	Original Value	Comments
Cure Time	60.0 min @Temperature 95.0 °C
	120 min @Temperature 65.0 °C
	4320 min @Temperature 25.0 °C
Pot Life	30 min

Descriptive Properties
Color	Black
Mix Ratio by Weight (R/H)	100/5.2

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