Description: NGAC P907-30 is a high viscosity, controlled flow encapsulant designed for microelectronics applications requiring low shrinkage and high reliability performance. Advantages and Applications: Uses include protecting wire bonds and bare die and other micro-electronic structural assembly applications. NGAC P907-30 has a low CTE resulting in low shrinkage upon cure and no stress to substrates. It is highly resistant to humidity and will withstand reflow temperatures up to 260C. Information Provided by Nextgen Adhesives |