Description: HexPly® M77 is a fast curing hotmelt, thermosetting epoxy resin matrix, specifically designed for prepreg applications at which short cure cycles are required. M77 is recommended for curing at 120 – 150°C and is suitable for a range of pressures (5 – 35bar). M77 can be used for manufacture of large industrial components, suitable for cure of thin and thick sections.Information provided by Hexcel Corporation. |