MULTICLAD™ HF represents the next generation low-loss thermoset and prepreg system for high-speed and high-frequency printed circuit boards. This technology combines a low-loss, high reliability thermoset resin system with non-brominated flame retardant system to create a material that is great in terms of electrical performance, durability and cost.- First generation environmentally friendly laminate system with competitive Insertion Loss and Loss Tangent (Df < 0.005) for High Frequency applications
- Non-PTFE Formulation meets standard lead-free process requirements, while maintaining low-halogen content per current industry standards
- Improved thermal robustness cover competing low-loss thermoset materials for better device reliability and performance consistency over time
- Low Thermal Expansion and High Glass Transition Temperature minimizes potential for PTH failures and improves operating reliability
- Low moisture absorption for improved processing and consistent performance
- Decomposition temperature > 350°C is ideally suited for lead-free solder processing
- Low TCEr (temperature coefficient of the dielectric) minimizes electrical phase variation with temperature
- Certified to UL flammability requirements of UL-94 V0
Typical Applications: - High-Speed Digital backplanes and server boards
- RF Power Amplifier motherboards
- Satellite receivers, LNB converters, and other Wireless devices
- Semiconductor burn-in-boards and other high speed, high reliability applications
Information provided by Arlon Silicone Technologies Division; now a part of Rogers Corporation. |
