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Chemically Resistant adhesives

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Epoxy Technology EPO-TEK® N20E Electrically Conductive Paste
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive

Material Notes: Product Description: EPO-TEK® N20E is a two component, electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly. Its applications and field conditions include the optical, sensor, consumer, and industrial industries.

Advantages & Application Notes:

  • Pot life of more than one day allows for mass production and minimal waste.
  • A convenient, simple 1:1 mix ratio allows for specialty packaging including double-barrel syringes, or BIPAX.
  • Suggested applications:
    • PCB / Electronics: EMI and Rf shielding of Rf and Microwave devices.
    • Opto-electronics: IR, digital imaging, and sensor device interconnects.
  • Versatility in cure allows for low temperature, box oven, SMT tunnel oven, hand held, or snap curing techniques to be realized.
  • Thixotropic nature allows for deposition methods like dispensing, screen printing, stamping, or other patterning techniques.

Information Provided by Epoxy Technology

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Physical PropertiesOriginal ValueComments
Specific Gravity 2.86 g/ccPart B
 2.93 g/ccPart A
Particle Size <= 45 µm
Viscosity 5000 - 10000 cP
@Temperature 23.0 °C
20 rpm
 
Chemical PropertiesOriginal ValueComments
Ionic Impurities - Na (Sodium) 265 ppm
Ionic Impurities - K (Potassium) 10 ppm
Ionic Impurities - Cl (Chloride) 34 ppm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 50
Tensile Modulus 1.142e+6 psiStorage
Shear Strength >= 3400 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity <= 0.070 ohm-cm
 
Thermal PropertiesOriginal ValueComments
CTE, linear 27.0 µm/m-°CBelow Tg
 89.0 µm/m-°CAbove Tg
Thermal Conductivity 1.19 W/m-K
Maximum Service Temperature, Air 200 °CContinuous
 300 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 70.0 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 478 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Cure Time 5.00 min
@Temperature 150 °C
Minimum Bond Line
 15.0 min
@Temperature 120 °C
Minimum Bond Line
Pot Life 2160 min
Shelf Life 12.0 Month
@Temperature 25.0 °C
 
Descriptive Properties
ColorDark GreyPart A
 Dark GreyPart B
ConsistencySmooth Paste
Ionic Impurities NH416 ppm
Mix Ratio by Weight1:1
Number of ComponentsTwo
Thixotropic Index1.9
Weight Loss0.07%200°C
 0.22%250°C
 0.81%300°C

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Chemically Resistant adhesives

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