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Chemically Resistant adhesives

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Epoxy Technology EPO-TEK® E2036 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Product Description: A two component, slightly flexible, silver-filled, electrically conductive adhesive for semiconductor and electronic assemblies. It is a low Tg epoxy, intended for many kinds of electronics at the PCB level, flex circuitry, or optical and medical devices. It can be used for resisting thermal cycles, high vibration applications or resisting PCB drop tests.

Information Provided by Epoxy Technology

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Physical PropertiesOriginal ValueComments
Specific Gravity 2.81 g/ccPart A
 3.52 g/ccPart B
Particle Size <= 20 µm
Viscosity 10000 - 20000 cP
@Temperature 23.0 °C
20 rpm
 
Chemical PropertiesOriginal ValueComments
Ionic Impurities - Na (Sodium) 1.0 ppm
Ionic Impurities - K (Potassium) 8.0 ppm
Ionic Impurities - Cl (Chloride) 422 ppm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 75
Tensile Modulus 638000 psiStorage
Shear Strength 1492 psiLap
 >= 1700 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 0.00030 ohm-cm
 
Thermal PropertiesOriginal ValueComments
CTE, linear 39.0 µm/m-°CBelow Tg
 178 µm/m-°CAbove Tg
Thermal Conductivity 1.53 W/m-K
Maximum Service Temperature, Air 250 °CContinuous
 350 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 30.0 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 444 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Cure Time 1.00 hour
@Temperature 150 °C
Pot Life 4320 min
Shelf Life 12.0 Month
@Temperature 25.0 °C
 
Descriptive Properties
ColorSilverPart A
 SilverPart B
ConsistencySoft, smooth paste
Ionic Impurities NH4159 ppm
Mix Ratio by Weight3:1
Number of ComponentsTwo
Thixotropic Index3.95
Weight Loss0.13%200°C
 0.32%250°C
 0.65%300°C

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PPOXYT007 / 141045

Chemically Resistant adhesives

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