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Flame Retardant adhesives

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Sumitomo Bakelite North America Epiall® 2061B-1 Mineral and Glass Filled Electrical Encapsulation Grade Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Encapsulating, Glass or Mineral Filled; Filled/Reinforced Thermoset

Material Notes: Epiall 2061B-1 is a fiberglass and mineral reinforced epoxy molding compound, with excellent dimensional stability, good electrical insulation properties, and good strength.

Information provided by Sumitomo Bakelite North America, Inc.

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Physical PropertiesOriginal ValueComments
Bulk Density 0.800 g/ccASTM D1895
Density 1.90 g/ccASTM D792
Water Absorption 0.20 %
@Temperature 50.0 °C,
Time 173000 sec
ASTM D570
Linear Mold Shrinkage 0.0030 - 0.0050 cm/cmASTM D955
 
Mechanical PropertiesOriginal ValueComments
Hardness, Barcol 70ASTM D2583
Tensile Strength at Break 90.0 MPaASTM D638
Flexural Strength 138 MPaat rupture; ASTM D790
Flexural Modulus 15.9 GPaASTM D790
Compressive Strength 230 MPaASTM D695
Izod Impact, Notched 37.0 J/mASTM D256
 
Electrical PropertiesOriginal ValueComments
Dielectric Constant 3.8
@Frequency 1e+6 Hz
wet; ASTM D150
Dielectric Strength 13.2 kV/mm
@Frequency 60 Hz
step-by-step, wet; ASTM D149
 13.6 kV/mm
@Frequency 60 Hz
short time, wet; ASTM D149
Dissipation Factor 0.016
@Frequency 1e+6 Hz
wet; ASTM D150
Arc Resistance 180 secASTM D495
 
Thermal PropertiesOriginal ValueComments
CTE, linear, Parallel to Flow 19.4 µm/m-°Cpost baked; ASTM E831
 28.5 µm/m-°Cas molded; ASTM E831
CTE, linear, Transverse to Flow 26.4 µm/m-°Cpost baked; ASTM E831
 40.9 µm/m-°Cas molded; ASTM E831
Maximum Service Temperature, Air 130 °CUL Temperature Index; UL 746B
Deflection Temperature at 1.8 MPa (264 psi) 165 °CAs Molded; ASTM D648A
Flammability, UL94 V-0
@Thickness 1.60 mm
 
Descriptive Properties
ColorBlack
FormGranular
Molding MethodCompression
 Transfer

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P90X906 / 142681

Flame Retardant adhesives

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