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Morgan Advanced Ceramics Vacupor® MS Porextherm
Categories: Ceramic; Oxide; Silicon Oxide

Material Notes: VACUPOR® MS is a microporous insulation material with an extremely low coefficient of thermal conductivity, i.e. with very good insulating properties. VACUPOR® MS consists basically of inorganic oxides. The main constituent is fumed silica, the other components are opacifiers for minimizing nfrared radiation, and silicates. The barrier film wrapping of VACUPOR® MS isprocessed in form of a double middle seam. This results in a particularly good surface quality. Due to the missing side flaps, the panels can almost be form-fit sticked together butt joint. In foaming processes the foam flow is significantly less constrained, and the formation of cavities is significantly reduced. VACUPOR® MS (core material) is not flammable and is classified A1 according to DIN ISO EN 13501-1. VACUPOR® MS is heat sealed in a metallized, multilayer plastic film under vacuum. The very low internal pressure and the microporous panel core is responsible for the extremely low thermal conductivity values.

Application: VACUPOR® MS was specifically developed for vacuum insulation applications in the appliance- / refrigeration industry, where increased demands on the surface, dimensional stability, defined formats and foaming properties are defined. Due to various technical improvements the performance of VACUPOR® MS systems could be reduced significantly. VACUPOR® MS is also sucessfully used as insulation material in the following areas: Refrigerators and freezers, Cryogenic, freezers, Temperature controlled packaging.

Information provided by Morgan Advanced Materials

Key Words: Porextherm
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Physical PropertiesOriginal ValueComments
Density 0.160 - 0.190 g/cc
 
Mechanical PropertiesOriginal ValueComments
Compressive Strength 0.0500 MPaat 180 kg/m3
 1.00 MPaat 210 kg/m3
 1.50 MPaat 230 kg/m3
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 0.00350 W/m-K
@Temperature -20.0 °C
 0.00400 W/m-K
@Temperature 20.0 °C
 0.00450 W/m-K
@Temperature 80.0 °C
 <= 0.0190 W/m-K
@Temperature 10.0 °C
at ambient pressure
 0.00363 W/m-K
@Pressure 1.00e-7 MPa
 0.00366 W/m-K
@Pressure 0.0000100 MPa
 0.00375 W/m-K
@Pressure 0.000100 MPa
 0.00425 W/m-K
@Pressure 0.00100 MPa
 0.00870 W/m-K
@Pressure 0.0150 MPa
 <= 0.00370 W/m-K
@Pressure 0.100 MPa,
Temperature 10.0 °C
 
Descriptive Properties
Colorsilver
Compression Behavior (%)10at 1 bar, 160kg/m3
 10at 3 bar, 230 kg/m3
 15at 2 bar, 160 kg/m3
 20at 3 bar, 160 kg/m3
 5at 1 bar, 230kg/m3
 8at 2 bar, 230 kg/m3
Heat Resistance-50 - 120°C, caused by film weld seam. The limits are fixed by the barrier film (sealing material) used; constant load: <=80°C; short load time with 120°C: roughly 30 minutes

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CMORF6134 / 202918

Specialty Compounds RTP Company

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