Envalior ForTii® Eco LDS62B PA*-GF35 PA4T High Temperature Polyamide

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Envalior ForTii® Eco LDS62B PA*-GF35 PA4T High Temperature Polyamide
Categories:	Polymer; Renewable/Recycled Polymer; Thermoplastic; Nylon (Polyamide PA)
Material Notes:	ForTii® is a high temperature polyamide for applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries. ForTii® Eco LDS62B is a high ductility LDS material which enables good structural integrity in complicated geometries. It is well suited for wearable devices and smart phone antennas for consumer electronics. It has excellent dimensional stability to ensure low warpage after chemical plating. Eco LDS62B is Eco-friendly due to its partly bio-based content. Features: Bio-based - 14C measurable. Laser Direct Structuring. Low warpage. 35% glass reinforced. Processing: Injection molding. Former DSM Engineering Plastics product line is now with Envalior.
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Physical Properties	Original Value	Comments

Density	1.50 g/cc	Dry; ISO 1183
Linear Mold Shrinkage, Flow	0.0021 cm/cm	Dry; ISO 294-4
Linear Mold Shrinkage, Transverse	0.0070 cm/cm	Dry; ISO 294-4

Mechanical Properties	Original Value	Comments
Tensile Strength at Break	130 MPa	Dry; ISO 527-1/-2
Elongation at Break	1.7 %	Dry; ISO 527-1/-2
Tensile Modulus	11500 MPa	Dry; ISO 527-1/-2
Flexural Strength	190 MPa	Dry; ISO 178
Flexural Modulus	10000 MPa	Dry; ISO 178
Charpy Impact, Notched	4.60 kJ/m² @Temperature 23.0 °C	Dry; ISO 179/1eA

Electrical Properties	Original Value	Comments
Dielectric Constant	3.74 @Frequency 1e+9 Hz	Dry; IEC 60250
	3.8 @Frequency 1e+9 Hz	Cond; IEC 60250

Thermal Properties	Original Value	Comments
CTE, linear	66.0 µm/m-°C	Dry; ISO 11359-1/-2
CTE, linear, Parallel to Flow	17.0 µm/m-°C	Dry; ISO 11359-1/-2
Melting Point	319 °C	10°C/min. Dry; ISO 11357-1/-3
Deflection Temperature at 1.8 MPa (264 psi)	235 °C	Dry; ISO 75-1/-2
Flammability, UL94	HB @Thickness 1.50 mm	Dry; IEC 60695-11-10
	HB @Thickness 3.00 mm	Dry; IEC 60695-11-10

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PDSM7929 / 291365

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