Arlon Electronic Materials 35N Fast Cure Polyimide Laminate and Prepreg

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Arlon Electronic Materials 35N Fast Cure Polyimide Laminate and Prepreg
Categories:	Polymer; Thermoset; Polyimide, TS
Material Notes:	High reliability and high temperature material 35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles. Low Z-expansion minimizes the risk of PTH defects caused during solder reflow and device attachment Electrical and mechanical properties meeting the requirements of IPC-4101/40 and /41 Toughened. Non-MDA chemistry resists drill cracking Compatible with lead-free processing RoHS/WEEE compliant Typical Applications: PCBs that are subjected to high temperatures during processing, such as lead-free soldering Applications with significant lifetimes at high temperatures, such as aircraft engine instrumentation, down hole drilling, under-hood automotive controls, burn-in boards, or industrial sensors. Information provided by ARLON Electronic Materials.
Vendors:	Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets. Click here to view all available suppliers for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
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Physical Properties	Original Value	Comments

Density	1.60 g/cc	ASTM D792 Method A
Water Absorption	0.26 %	IPC TM-650 2.6.2.1

Mechanical Properties	Original Value	Comments
Tensile Strength	36300 psi	y; IPC TM-650 2.4.18.3
	69000 psi	x; IPC TM-650 2.4.18.3
Modulus of Elasticity	3800 ksi	y; IPC TM-650 2.4.18.3
	4300 ksi	x; IPC TM-650 2.4.18.3
Poissons Ratio	0.15	y; ASTM D3039
	0.16	x; ASTM D3039
Peel Strength	6.00 pli	To Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8
	6.30 pli	To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
	6.30 pli	To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2

Electrical Properties	Original Value	Comments
Volume Resistivity	1.20e+14 ohm-cm	E24/125; IPC TM-650 2.5.17.1
	1.60e+14 ohm-cm	C96/35/90; IPC TM-650 2.5.17.1
Surface Resistance	3.70e+14 ohm	E24/125; IPC TM-650 2.5.17.1
	5.00e+14 ohm	C96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant	4.2 @Frequency 1e+6 Hz	May vary with resin %; IPC TM-650 2.5.5.3
Dielectric Strength	1400 V/mil	IPC TM-650 2.5.6.2
Dissipation Factor	0.010	IPC TM-650 2.5.5.3
Arc Resistance	165 sec	IPC TM-650 2.5.1

Thermal Properties	Original Value	Comments
CTE, linear	16.0 µm/m-°C	IPC TM-650 2.4.41
CTE, linear, Transverse to Flow	51.0 µm/m-°C @Temperature <=250 °C	z (< Tg); IPC TM-650 2.4.24
	158 µm/m-°C @Temperature >=250 °C	z (> Tg); IPC TM-650 2.4.24
Thermal Conductivity	0.200 W/m-K	ASTM E1461
Glass Transition Temp, Tg	250 °C	TMA; IPC TM-650 2.4.24
Decomposition Temperature	363 °C	Onset; IPC TM-650 2.3.41
	407 °C	5 percent; IPC TM-650 2.3.41
Flammability, UL94	V-1

Descriptive Properties
IPC Delamination - T260 (minutes)	> 60	IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes)	> 60	IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes)	11	IPC TM-650 2.4.24.1
Z-Axis Expansion (%)	1.2	IPC TM-650 2.4.24 (50-260°C)

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