Resin Technology Group UV-S-2051 High Impact, UV Curable Plastic Bonder

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Resin Technology Group UV-S-2051 High Impact, UV Curable Plastic Bonder
Categories:	Polymer; Adhesive; Thermoset
Material Notes:	UV S-2051 is a general purpose, fast cure response, high thermal-shock resistant, UV curing adhesive designed for use in a variety of applications including chip bonding, laminating, tacking, and sealing. It’s rubber modification provides low cure shrinkage and high-impact resistant bonds. UV S-2051 has excellent adhesion to PVC, polycarbonate, polyurethane, flexible PCB, ceramics, glass, FR4 and other plastics. Applications: Automotive underhood, head lamps, connector sealing, coil terminating, transducer mountings, potting switches, chip bonding, hybrid modules, potting. Processing: UV light cure: Intensity of 200 mw/cm2; Spectral output of 300 to 500 nanometers; Optimum wavelength of 375 nanometers Recommended Aurora UV light sources: Aurora 455-S 5x5 High Intensity Flood Aurora 461-S 1x6 High Intensity Beam Aurora 100-S Spot Light Guide Information provided by Resin Technology Group.
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Physical Properties	Original Value	Comments

Viscosity	2500 cP @Temperature 25.0 °C	Uncured

Mechanical Properties	Original Value	Comments
Hardness, Shore A	84	Cured
Hardness, Shore D	85	Cured
Elongation at Break	200 %	Cured
Shear Strength	2000 psi	Tensile
Peel Strength	30.0 pli	Given in psi

Electrical Properties	Original Value	Comments
Dielectric Strength	400 V/mil	Cured

Thermal Properties	Original Value	Comments
Maximum Service Temperature, Air	150 °C	Cured
Minimum Service Temperature, Air	-50.0 °C	Cured
Flash Point	>= 200 °F	Uncured

Optical Properties	Original Value	Comments
Transmission, Visible	80 %	Mfr. Specifies clear but does not quantify

Descriptive Properties
Color	Clear
Composition	Modified Acrylic Resin
Toxicity	Low

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