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Chemically Resistant adhesives

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Epoxy Technology EPO-TEK® ED1021 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Preliminary Product Information Sheet

Material Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its ability to achieve high thermal conductivity values at low cure temperatures and a very shiny silver appearance which enhances overall LED brightness. Other benefits include long pot-life, low viscosity and high thixotropy making it ideal for wafer level stamping as well as syringe dispensing.

Information Provided by Epoxy Technology

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Physical PropertiesOriginal ValueComments
Specific Gravity 2.80 g/cc
Particle Size <= 20 µm
Viscosity 1819 cP
@Temperature 23.0 °C
100 rpm
 8782 cP
@Temperature 23.0 °C
10 rpm
 37282 cP
@Temperature 23.0 °C
1 rpm
 
Chemical PropertiesOriginal ValueComments
Ionic Impurities - Na (Sodium) 3.0 ppm
Ionic Impurities - K (Potassium) 1.0 ppm
Ionic Impurities - Cl (Chloride) <= 10 ppm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 82
Tensile Modulus 25850 psiStorage
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity <= 0.00020 ohm-cm
 
Thermal PropertiesOriginal ValueComments
CTE, linear 5.20 µm/m-°CBelow Tg
 184 µm/m-°CAbove Tg
Thermal Conductivity 3.30 W/m-K
Maximum Service Temperature, Air 200 °CContinuous
 300 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 48.0 °C
Decomposition Temperature 403 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Cure Time 30.0 min
@Temperature 150 °C
Pot Life 129600 min
Shelf Life 12.0 Month
@Temperature -40.0 °C
 
Descriptive Properties
ColorSilver
ConsistencySmooth thixotropic paste
Die Shear12 kgAfter 1000hrs 85°C/85% RH
 12.4 kgInitial
Ionic Impurities NH49 ppm
Number of ComponentsSingle
Thixotropic Index4.2
Weight Loss0.35%200°C
 0.41%250°C
 0.56%300°C

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PPOXYT017 / 141055

Chemically Resistant adhesives

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