Arlon Electronic Materials 37N Polyimide Low-Flow

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Arlon Electronic Materials 37N Polyimide Low-Flow
Categories:	Polymer; Thermoset; Polyimide, TS
Material Notes:	37N is a polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required. Tg > 200°C and expansion characteristics typical of polyimide greatly improves PTH reliability Good bond strength to Kapton® polyimide, copper and other metals Curable at temperatures as low as 350°F Excellent thermal stability Available in different flow ranges and fiberglass styles for optimal process flexibility Electrical and mechanical properties meeting the requirements of IPC-4101/42 Compatible with lead-free solder processing RoHS/WEEE compliant Typical Applications: Bonding multilayer polyimide rigid-flex Attaching heat sinks to polyimide MLBs Other applications where minimal and uniform resin flow is required Information provided by ARLON Electronic Materials.
Vendors:	Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets. Click here to view all available suppliers for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
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Physical Properties	Original Value	Comments

Water Absorption	<= 1.0 %	IPC TM-650 2.6.2.1

Mechanical Properties	Original Value	Comments
Tensile Strength	32000 psi	IPC TM-650 2.4.18.3
Flexural Strength	60.0 ksi	IPC TM-650 2.4.4
Poissons Ratio	0.17	ASTM D3039
Peel Strength	4.20 pli	To Kapton, as received
	5.50 pli	To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2
	6.80 pli	To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
	9.20 pli	To Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8

Electrical Properties	Original Value	Comments
Volume Resistivity	4.70e+15 ohm-cm	E24/125; IPC TM-650 2.5.17.1
	8.20e+15 ohm-cm	C96/35/90; IPC TM-650 2.5.17.1
Surface Resistance	4.40e+12 ohm	C96/35/90; IPC TM-650 2.5.17.1
	1.20e+15 ohm	E24/125; IPC TM-650 2.5.17.1
Dielectric Constant	4.25 @Frequency 1e+6 Hz	may vary with resin %; IPC TM-650 2.5.5.3
Dielectric Strength	1330 V/mil	IPC TM-650 2.5.6.2
Dissipation Factor	0.018 @Frequency 1e+6 Hz	IPC TM-650 2.5.5.3
Arc Resistance	124 sec	IPC TM-650 2.5.1

Thermal Properties	Original Value	Comments
CTE, linear	16.0 µm/m-°C
CTE, linear, Transverse to Flow	76.0 µm/m-°C	z, below Tg; IPC TM-650 2.4.24
	252 µm/m-°C	z, above Tg; IPC TM-650 2.4.24
Thermal Conductivity	0.300 W/m-K	ASTM E1461
Glass Transition Temp, Tg	210 °C	TMA; IPC TM-650 2.4.24
Decomposition Temperature	322 °C	Onset; IPC TM-650 2.3.41
	340 °C	5 percent; IPC TM-650 2.3.41
Flammability, UL94	V-0

Descriptive Properties
IPC Delamination - T260 (minutes)	> 60	IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes)	5	IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes)	2	IPC TM-650 2.4.24.1
Z-Axis Expansion (%)	2.3	IPC TM-650 2.4.24 (50-260°C)

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PARLM9876 / 149029

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