MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Rulon Bearings

(Viewing data as-entered. Click here to return)
Rogers Arlon AD350A PTFE/Woven Fiberglass/Ceramic Filled Composite
Categories: Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)
Material Notes:
  • Tighter Dielectric Tolerance
  • Low Z-Axis Thermal Expansion
  • Ceramic Filled PTFE
  • High Thermal Conductivity
  • Large Panel Size

Benefits:

  • Higher Consistency of Performance
  • Superior PTH Adhesion
  • Heat Dissipation and Management
  • Multiple boards per panel; Larger Printed Circuit Board formats

Typical Applications:

  • High Power Applications
  • Low Noise Amplifiers (LNAs)
  • Low Noise Blocks (LNBs)
  • Filters and Couplers

Information provided by Arlon Materials for Electronics (MED); now a part of Rogers Corporation.
Vendors: Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets.

Click here to view all available suppliers for this material.

Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 2.10 g/ccASTM D792 Method A
Water Absorption 0.10 %IPC TM-650 2.6.2.2
Outgassing - Total Mass Loss 0.00 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		Water Vapor Recovered; NASA SP-R-0022A
 0.020 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		NASA SP-R-0022A
Collected Volatile Condensable Material 0.020 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		NASA SP-R-0022A
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength >= 20000 psiIPC TM-650 2.4.18
Modulus of Elasticity >= 700 ksiASTM D638
Flexural Modulus >= 540 ksiASTM D790
Compressive Modulus >= 350 ksiASTM D695
Peel Strength 15.0 pliTo Copper (1/2 oz.); A, TS; IPC TM-650 2.4.8
 17.0 pliTo Copper (1 oz.); A, TS; IPC TM-650 2.4.8
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.20e+15 ohm-cmC96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 4.50e+13 ohmC96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant 3.45 - 3.55
@Frequency 1e+10 Hz		C23/50; IPC TM-650 2.5.5.5
Dielectric Breakdown >= 45000 VD48/50; ASTM D149
Dissipation Factor 0.0030
@Frequency 1e+10 Hz		C23/50; IPC TM-650 2.5.5.5
Arc Resistance >= 180 secD48/50; IPC TM-650 2.5.1B
 
Thermal PropertiesOriginal ValueComments
CTE, linear 5.00 µm/m-°C
@Temperature 0.000 - 100 °C		x direction; IPC TM-650 2.4.24
 9.00 µm/m-°C
@Temperature 0.000 - 100 °C		y direction; IPC TM-650 2.4.24
CTE, linear, Transverse to Flow 35.0 µm/m-°C
@Temperature 0.000 - 100 °C		z direction; IPC TM-650 2.4.24
Thermal Conductivity 0.450 W/m-K
@Temperature 100 °C		ASTM E1225
Flammability, UL94 V-0Vertical Burn
 
Descriptive Properties
Temperature Coefficient of Dielectric (ppm/°C)-55IPC TM-650 2.5.5.5; at 10 GHz (-40 - 150°C)

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

Users viewing this material also viewed the following:
E-Glass Fiber, Generic
DIAB Divinycell® HP 80 Sandwich Core Material
DIAB Divinycell® HP 200 Sandwich Core Material
DIAB Divinycell® HP 130 Sandwich Core Material
DIAB Divinycell® H 80 Sandwich Core Material

PARLM9887 / 149040

Master Bond adhesives




Searches:   Advanced  •   Composition  •   Property  •   Material Type  •   Manufacturer  •   Trade Name  •   UNS Number
Other Links:   Advertising  •   Submit Data  •   Database Licensing  •   Web Design & Hosting  •   Trade Publications
Supplier List  •   Unit Converter  •   Reference  •   Links  •   Help  •   Contact Us  •   Site Map  •   FAQ  •   Home
 
Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.