Emerson & Cuming 56C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy Adhesive Silver filled, high electrical conductivity, epoxy adhesive. Excellent thermal conductivity. Requires heat cure to obtain optimal properties. Recommended for applications where hot soldering is impractical. Listed on many government specifications. Mix ratio of 100:2.5. Cure Type: Heat Bonding Type: Epoxy The Eccobond® product line is now a part of Henkel; this specific grade is discontinued. |