Appearance: White Product Benefits: - Extremely flexible
- Low temperature cure
- Thermally conductive
- Electrically Insulating
Cure: Heat cureApplication: Assembly Typical Package Applications: Package LOCTITE ABLESTIK 566K is designed for bonding dissimilar materials with mismatched coefficients of thermal expansion. This material is a low temperature cure version of LOCTITE ABLESTIK 561K adhesive. Information provided by Loctite® |