Resinlab™ EP1325 and EP1325LV are one part thixotropic, heat curing epoxy adhesives. They can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where the application requires low shrinkage and excellent adhesion to a wide variety of plastics, metals and circuit board materials. These products give very good environmental protection and dielectric properties over a wide temperature range. The primary difference between the two versions is the LV version has a lower high shear viscosity (higher press flow rate) to provide easier dispensing. The amount of sag upon curing is the same.Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company. |