Solvay CORFIL® 5250-4 Potting Compound

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Solvay CORFIL® 5250-4 Potting Compound
Categories:	Polymer; Thermoset; Bismaleimide (BMI)
Material Notes:	CORFIL® 5250-4 is a single component, non-metallic filled, syntactic material formulated for use in insert potting, edge filling and core filling of high temperature honeycomb sandwich structures. CORFIL 5250-4 is based on bismaleimide (BMI) chemistry and is available in six and twelve ounce easy-to-use cartridges. Features & Benefits : Co-curable with BMI composite materials Use in metallic and non-metallic honeycomb Excellent compressive strength up to 475°F (246°C) Easily spreadable Applications: CORFIL 5250-4 is commonly used for honeycomb core filling, insert potting and edge filling applications in BMI composite (CYCOM® 5250-4) honeycomb sandwich panel construction. Information provided by Cytec, subsequently acquired by Solvay.
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Physical Properties	Original Value	Comments

Density	0.800 g/cc
Solids Content	100 %
Storage Temperature	-18.0 °C

Mechanical Properties	Original Value	Comments
Compressive Strength	2250 psi @Temperature 246 °C	Cured
	7500 psi @Temperature 177 °C	Cured
	12000 psi @Temperature 22.2 °C	Cured

Processing Properties	Original Value	Comments
Shelf Life	6.00 Month

Descriptive Properties
Color	Yellow

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PCYTED009 / 180311

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