Tosoh N Semiconductor standard grade, Fused Silica Glass

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

(Viewing data as-entered. Click here to return)

Tosoh N Semiconductor standard grade, Fused Silica Glass
Categories:	Ceramic; Glass
Material Notes:	Tosoh N and NP materials are manufactured by fusing a high-purity silica powder using Tosoh's proprietary oxy-hydrogen flame fusion process. Thanks to its high purity, low aluminum content, and extremely low level of bubbles and inclusions, N has become the reference material for a broad range of applications, such as semiconductor manufacturing, metrology, optics, chemical processing, UV and high temperature windows. In particular, N is an enabling material for stringent plasma etch processes used in leading-edge semiconductor manufacturing. NP is an enhanced version of N material, with further reduced alkali content for use in processes that require extreme contamination control. Available in up to 1,200mm square and 580 mm round ingots, N and NP materials are 450mm wafer ready. Information provided by Tosh Corporation
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Original Value	Comments

Density	2.20 g/cc
Viscosity	12700 cP @Temperature 1200 °C

Mechanical Properties	Original Value	Comments
Hardness, Vickers	907.5
Tensile Strength	50.0 MPa
Modulus of Elasticity	74.0 GPa	Young's
Flexural Strength	65.0 - 95.0 MPa
Compressive Strength	1.13 MPa
Poissons Ratio	0.17
Shear Modulus	31.0 GPa
Torsional Stiffness	29.0 MPa

Electrical Properties	Original Value	Comments
Volume Resistivity	5.00e+16 ohm-cm
Surface Resistance	3.00e+15 ohm
Dielectric Constant	3.9 @Frequency 5.00e+8 Hz
Dielectric Strength	32.0 kV/mm @Frequency 50 Hz
Dielectric Loss Index	<= 1.0 @Frequency 5.00e+8 Hz

Thermal Properties	Original Value	Comments
CTE, linear	0.570 µm/m-°C @Temperature 30.0 - 600 °C
Specific Heat Capacity	0.749 J/g-°C
Thermal Conductivity	1.38 W/m-K
Softening Point	1720 °C	(?=107.6)*2
Annealing Point	1180 °C	(?=1013)
Strain Point	1080 °C	(?=1014.5)

Descriptive Properties
Chemical Properties	? 0.01ppm	Cu
	0.07 ppm	Li
	0.11 ppm	Mg
	0.12 ppm	K
	0.31 ppm	Fe
	0.9 ppm	Ca
	1.01 ppm	Na
	230 ppm	OH
	9.1 ppm	Al

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

PTOSOH006 / 306464

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message