Epoxy Technology EPO-TEK® H75 Thermally Conductive, Electrically Insulating Epoxy

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Epoxy Technology EPO-TEK® H75 Thermally Conductive, Electrically Insulating Epoxy
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes:	Material Description: A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be considered a higher viscosity alternative to EPO-TEK® H74. Information Provided by Epoxy Technology
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Physical Properties	Original Value	Comments

Specific Gravity	1.02 g/cc	Part B
	2.27 g/cc	Part A
Particle Size	<= 50 µm
Viscosity	300000 - 400000 cP @Temperature 23.0 °C	0.5 rpm

Mechanical Properties	Original Value	Comments
Hardness, Shore D	95
Tensile Modulus	946000 psi	Storage
Shear Strength	1892 psi	Lap
	>= 6800 psi	Die

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 2.00e+12 ohm-cm
Dielectric Constant	5.37 @Frequency 1000 Hz
Dissipation Factor	0.0080 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	29.0 µm/m-°C	Below Tg
	90.0 µm/m-°C	Above Tg
Thermal Conductivity	0.660 W/m-K
Maximum Service Temperature, Air	250 °C	Continuous
	350 °C	Intermittent
Minimum Service Temperature, Air	-55.0 °C	Continuous
	-55.0 °C	Intermittent
Glass Transition Temp, Tg	>= 100 °C	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature	416 °C	Degradation Temperature

Processing Properties	Original Value	Comments
Cure Time	5.00 min @Temperature 150 °C	Minimum
	30.0 min @Temperature 100 °C	Minimum
Pot Life	180 min
Shelf Life	12.0 Month @Temperature 25.0 °C

Descriptive Properties
Color	Amber	Part B
	Gray	Part A
Consistency	Thick paste
Mix Ratio by Weight	100:3.3
Number of Components	Two
Weight Loss	<0.05%	200°C
	0.2%	300°C
	0.8%	250°C

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PPOXYT083 / 141122

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