Solvay CORFIL® 625-1 Potting Compound

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Solvay CORFIL® 625-1 Potting Compound
Categories:	Polymer; Thermoset; Polyimide, TS
Material Notes:	Description: CORFIL® 625-1 potting compound is a one-part, low density material formulated for use in insert and edge filling of honeycomb core. It may also be used as a syntactic core splice adhesive. It is formulated to have low viscosity making it especially suitable for use with automated equipment. CORFIL 625-1 can be cured at either 250°F (121°C) or 350°F (177°C) with minimal to no exotherm in large applications. Features & Benefits: One-part pumpable material 250°F (121°C)/ 350°F (177°C) cure Minimal exotherm -67 to 350°F (-55 to 177°C) service range Information provided by Cytec, subsequently acquired by Solvay.
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Physical Properties	Original Value	Comments

Density	0.400 - 0.497 g/cc	Cured
	0.449 g/cc	Cured at 121°C
	0.449 g/cc	Cured at 177°C
Storage Temperature	<= -18.0 °C

Mechanical Properties	Original Value	Comments
Compressive Strength	3000 psi	Cured at 121°C
	3100 psi	Cured at 177°C
Shear Strength	270 psi @Temperature 121 °C	Tube, Cured at 121°C
	300 psi @Temperature 121 °C	Tube, Cured at 177°C
	1000 psi @Temperature 24.0 °C	Tube, Cured at 121°C
	1200 psi @Temperature 24.0 °C	Tube, Cured at 177°C
	1200 psi @Temperature 82.0 °C	Tube, Cured at 121°C
	1300 psi @Temperature 82.0 °C	Tube, Cured at 177°C

Thermal Properties	Original Value	Comments
Maximum Service Temperature, Air	177 °C
Minimum Service Temperature, Air	-55.0 °C

Processing Properties	Original Value	Comments
Shelf Life	6.00 Month

Descriptive Properties
Color	White

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PCYTED011 / 180313

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